From chips to dust: the MEMS shatter secure chip

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Publication Type pre-print
School or College College of Engineering
Department Electrical & Computer Engineering
Creator Mastrangelo, Carlos H.
Other Author Banerjee, N.; Xie, Y.; Rahman, M. M.; Kim, H.
Title From chips to dust: the MEMS shatter secure chip
Date 2014-01-01
Description This paper presents the implementation of a transience mechanism for silicon microchips via low-temperature post-processing steps that transform almost any electronic, optical or MEMS substrate chips into transient ones. Transience is achieved without any hazardous or explosive materials. Triggered chip transience is achieved by the incorporation of a distributed, thermally-activated expanding material on the chip backside. When heated at 160oC the expanding material produces massive chip cleavage mechanically shattering the chip into a heap of silicon dust.
Type Text
Publisher Institute of Electrical and Electronics Engineers (IEEE)
Issue 1123
First Page 1126
Language eng
Bibliographic Citation Banerjee, N., Xie, Y., Rahman, M. M., Kim, H., & Mastrangelo, C. H. (2014). From chips to dust: the MEMS shatter secure chip. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), 6765843, 1123-6.
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Identifier uspace,18670
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Reference URL https://collections.lib.utah.edu/ark:/87278/s6vm7nbg